Capillary Rise Capacity
Capillary rise describes how high a liquid solder rises into a gap without being drained by gravity. It depends on the gap size and the surface energy of the solder.
Physico-chemical mechanism of action
Capillary rise is a phenomenon where liquid solder rises into a gap without being drained by gravity. This is caused by surface forces between the solder and the gap walls. The narrower the gap and the higher the surface energy of the solder, the higher the solder rises in the gap.
Metallurgical relevance & risks when welding
In welding, capillary rise is especially important for filling holes and cracks. Too high a rise can cause the solder to rise excessively into the gap, making the fill uneven or too high. This can lead to stresses and possibly cracks in the structure.
Workshop practice & instructions
To control capillary rise during brazing, it is important to set the gap size precisely. A too narrow gap can cause the solder to rise excessively into the gap. The surface energy of the solder should also be optimized to ensure even filling. When selecting the solder, ensure it has an appropriate capillary rise for the specific application.