Corrosive Flux Residues
Corrosive flux residues are chemical decomposition products of the soldering process that trigger electrochemical corrosion when exposed to moisture. Complete post-cleaning is essential for component safety.
Physical-Chemical Mechanism of Action
Corrosive flux residues are formed by chemical reactions during the soldering process. They consist of salts and other breakdown products dissolved in the flux. On contact with moisture, these residues react electrochemically and can corrode metals.
Metallurgical Relevance & Welding Risks
These residues can cause corrosion of components, especially if they are not completely removed. This can lead to cracks, wear, and reduced service life of the parts. In addition, they impair electrical insulation and the functionality of electronic components.
Workshop Practice & Action Points
After soldering, thorough post-cleaning is essential. Use a clean, fine-grained cloth or a special solder cleaning agent. Make sure all residues are completely removed and no liquid remains on the parts. Effective cleaning can be achieved by using insulating adhesive or a suitable surface treatment.