Solder Distribution Mechanism
The solder distribution mechanism guides the molten solder through the joint gap under the influence of capillary force, gravity, and viscosity. It determines the homogeneity of the final joint.
Physical-Chemical Mechanism of Action
The liquid filler metal is drawn through the joint gap by capillary forces and pulled down by gravity. The viscosity of the filler metal affects its flowability and can hinder the flow.
Metallurgical Relevance & Welding Risks
Uneven filler metal distribution leads to inconsistent joints and can cause stress concentrations and cracks in the joint area. Too high viscosity slows down the flow, leading to long cooling times and possible hot cracking.
Workshop Practice & Action Guidelines
Make sure the filler metal flows well through the joint gap. Use flux if needed to lower viscosity. Watch the cooling time and avoid cooling too fast or too slow.