Ultrasonic Wire Bonding
Ultrasonic wire bonding is a micro-joining process that connects fine gold or aluminum wires to contacts using ultrasonic energy and pressure. It creates reliable electrical connections.
Physical-Chemical Working Principle
Ultrasonic wire bonding uses the vibration energy of ultrasonic waves to press fine wires onto contact surfaces. The energy of the ultrasonic waves causes the materials at the contact points to deform plastically and bond firmly.
Metallurgical Relevance & Welding Risks
This process is especially suitable for high-performance semiconductor applications. It avoids introducing metals or bonding agents, which enhances the functionality of semiconductor components. However, incorrect setting of the ultrasonic level or contact force can lead to incomplete bonding or even tearing of the wires.
Workshop Practice & Operating Instructions
Ultrasonic wire bonding requires a special machine that controls both the ultrasonic level and the contact force. The pressure should be between 10 and 20 N/mm², and the ultrasonic level should be set between 50 and 70 kHz. The contacts should be cleaned thoroughly before bonding to ensure an optimal joint.