Ultrasonic micro wire bonding
Ultrasonic microwire welding is a joining technique where fine wires are bonded to metallized substrates by friction under ultrasonic influence. It enables high precision and minimal deformation.
Physikalisch-chemischer Wirkmechanismus
Ultrasonic microwire welding uses the energy of a high-frequency ultrasonic wave to apply pressure on the material to be welded. This leads to plastic deformation and the formation of a metallurgically bonded contact between the wires and the substrate.
Metallurgical Relevance & Welding Risks
This technique is especially suitable for fine, highly conductive materials like silicon or germanium. Incorrect ultrasonic amplitude or frequency can lead to incomplete bonding or damage to the material. Too much energy can cause overheating and deformation of the components.
Workshop Practice & Operating Instructions
For successful ultrasonic microwire welding, a precisely calibrated ultrasonic system is required. The wires should be clean and free of contaminants. The ultrasonic amplitude should be between 20 and 50 µm, and the frequency should be set at 100 kHz. Continuous monitoring of temperature and pressure is necessary to ensure no damage occurs.