Soft Solder Creep Tendency
Soft solder creep tendency is a time-dependent plastic deformation of tin-based solders under constant mechanical tensile or shear stress, especially at elevated temperatures.
Physical-Chemical Mechanism of Action
Soft solder creep occurs due to plastic deformation of tin-based materials under constant mechanical stress. At elevated temperatures, the crystal structure of the solder weakens, leading to long-term deformation.
Metallurgical Relevance & Welding Risks
Creep can lead to long-term deformation and loss of precise shape in solder joints. This can cause safety issues or functional failures in electronic devices. The tendency is especially strong at high temperatures.
Workshop Practice & Action Guidelines
To minimize soft solder creep, use solder at low temperatures and low mechanical stress. At high temperatures, it's advisable to regularly check shape and position.